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Product Information | DISCO Corporation

Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.

Dicing and Grinding Service | Solutions | DISCO Corporation

Dicing and Grinding Service. This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA (San Jose). It is also possible to provide these services with machines that ...

Grinding | Solutions | DISCO Corporation

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge ...

Ring Grinding | Grinding | Solutions | DISCO Corporation

Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. Precision ... generated between the tape and wafer, which has a negative impact on the dicing. The ring grinding minimizes this height difference, so that it ...

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This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are not shown here.

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Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in processes or addition of equipment, Poligrind helps improve post-grinding surface roughness, die strength, and overall process quality. Can …

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Global key manufacturers of Wafer Grinding Equipment include Okamoto Semiconductor Equipment Division, Strasbaugh, Disco, G&N Genauigkeits Maschinenbau Nürnberg , and GigaMat, etc. In terms of revenue, the global top four players hold a share over % in 2021. By Type,it can be divided into the following: Wafer Edge Grinder. Wafer Surface ...

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DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. NCG measure wafer thickness without contact, and has advantage below. Avoidance wafer breakage risk by …

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Combining DISCO's precision grinding equipment with Applied's etch, dielectric deposition, physical vapor deposition and chemical mechanical planarization systems, the two companies expect to develop wafer thinning and post-thinning processes of …

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DISCO EUROPE DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction. SERVICES Dicing Most Accurate Singulation More

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Jul 01, 2016· Iwasaki et al. proposed a corrosion model for the grinding media, involving two types of galvanic cells, as shown in Fig. 3.In the differential abrasion cell, the abraded surface acts as an anode, whereas the un-abraded surface acts as a cathode, and the corresponding corrosion reactions are iron oxidation in the first area and oxygen reduction in the second.

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Dicing and Grinding Service | Solutions | DISCO Corporation Dicing and Grinding Service. This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA (San Jose). It is …

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servicing disco grinding equipment. Process Workflow 1 Processing by Each Equipment Stand-Alone Each step is performed by stand-alone equipment Protective tape BG tape for backside grinding is laminated onto the wafer surfaces circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the …

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The report Global Semiconductor Wafer Grinding Equipment Market 2022 evaluates the current and future market opportunities. The research study sheds light on some of the major drivers and restraints factors influencing the growth of the market. The market is segregated on the basis of product type, manufacturers, application, and geographical …